PRESS RELEASE: $1.3M Federal Government Supply Chain Resilience Initiative (SCRI) Grant to Hendon Semiconductors Supports Australian Business Capability Expansion
Media Release
January 2023
For Immediate Release
$1.3M Federal Government Supply Chain Resilience Initiative (SCRI) Grant to Hendon Semiconductors Supports Australian Business Capability Expansion.
• $1.3M government investment grant paired with a matching of funds from Hendon Semiconductors will modernise Hendon’s semiconductor and thick-film design and fabrication facility via advanced manufacturing technology.
• Federal grant allows accelerated delivery of improved production efficiency, capability, and capacity outcomes for local Adelaide manufacturer.
Hendon Semiconductors Pty Ltd, a division of Legend Corporation, is excited to announce it has successfully obtained a $1.3M grant as part of the Federal Government’s Supply Chain Resilience Initiative (SCRI) Round 2.
The Government’s SCRI objectives include working with industry to identify supply options to address vulnerabilities, including those identified in the Sovereign Manufacturing Capability Plan, by incentivising Australian businesses to invest in capabilities through new equipment, technology, skills, and processes.
For over 75 years, Hendon Semiconductors Pty Ltd have been designing and manufacturing everything from microelectronic circuits and subassemblies to final turnkey products. The current capabilities service businesses from the defence, medical, life sciences, rail, power distribution, housing, and consumer electronics industries.
“I’m thrilled at the opportunity to fast-track Hendon’s modernisation, particularly around our semiconductor and thick-film design and fabrication facility. I’m passionate about supporting Australian innovation and manufacturing and this grant will help us deliver greatly improved production efficiency, capability and capacity outcomes”, said Jason Gerard, General Manager for Hendon Semiconductors.
A total investment of $2.6M – including the matched funds from Hendon Semiconductors – will allow the company to procure and install state of the art equipment including a horizontal diffusion furnace with nitrogen capability, a laser trimming system, two screen printers, two far-infrared belt dryers, and an automated optical inspection machine.
The upgraded facility will be completed in March 2024 after extensive installation, process improvements, industry 4.0 capabilities and full customer qualifications are completed.
With the support of this grant, Hendon Semiconductor’s modernised facility addresses supply chain vulnerabilities in semiconductor thick-film applications; reducing disruption to domestic supply and service, increasing design and production capability, and increasing supply collaboration. With future growth in international markets, the increased capability creates several new jobs and provides existing employees with critical skills training.
Visit our website to see the current capabilities of Hendon at www.hendonsemiconductors.com.au
SCRI Successful Grants https://business.gov.au/grants-and-programs/supply-chain-resilience-initiative-round-2/grant-recipients